Найти книгу: "Adhesion in Microelectronics"

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today’s students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions, signals and their properties. Here he presents a helpful balance of theory, examples, and verification of results, while keeping mathematics and signal processing theory to a minimum. Key features: Presents a new learning approach that will greatly improve students’ ability to retain key concepts in electronics studies Match the evolution of Computer Aided Design (CAD) which focuses increasingly on high-level design Covers sub-functions as well as basic circuits and basic components Provides real-world examples to inspire a thorough understanding of global issues, before going into the detail of components and devices Discusses power conversion and management; an important area that is missing in other books on the subject End-of-chapter problems and self-training sections support the reader in exploring systems and understanding them at increasing levels of complexity A supporting website (http://www.wiley.com/WileyCDA/WileyTitle/productCd-047074555X,descCd-relatedWebsites.html) presents the interactive student lab, ElvisLAB, where students can conduct virtual experiments on circuits together with PowerPoint slides for lecturers. Inside this book you will find a complete explanation of electronics that can be applied across a range of disciplines including electrical engineering and physics. This comprehensive introduction will be of benefit to students studying electronics, as well as their lecturers and professors. Postgraduate engineers, those in vocational training, and design and application engineers will also find this book useful.

Specifically dedicated to polymer and biopolymer systems, Polymer Adhesion, Friction, and Lubrication guides readers to the scratch, wear, and lubrication properties of polymers and the engineering applications, from biomedical research to automotive engineering. Author Hongbo Zeng details different experimental and theoretical methods used to probe static and dynamic properties of polymer materials and biomacromolecular systems. Topics include the use of atomic force microscopy (AFM) to analyze nanotribology, polymer thin films and brushes, nanoparticles, rubber and tire technology, synovial joint lubrication, adhesion in paper products, bioMEMS, and electrorheological fluids.

Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, Francois Martin, Jean-Michel Hartmann, Veronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maitrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.

The book provides a unique overview on laser techniques and applications for the purpose of improving adhesion by altering surface chemistry and topography/morphology of the substrate. It details laser surface modification techniques for a wide range of industrially relevant materials (plastics, metals, ceramics, composites) with the aim to improve and enhance their adhesion to other materials. The joining of different materials is of critical importance in the fabrication of many and varied products.

The topic of wettabilty is extremely important from both fundamental and applied aspects. The applications of wettability range from self-cleaning windows to micro- and nanofluidics. This book represents the cumulative wisdom of a contingent of world-class (researchers engaged in the domain of wettability. In the last few years there has been tremendous interest in the «Lotus Leaf Effect» and in understanding its mechanism and how to replicate this effect for myriad applications. The topics of superhydrophobicity, omniphobicity and superhydrophilicity are of much contemporary interest and these are covered in depth in this book.