Найти книгу: "Lead-free Solders. Materials Reliability for Electronics"

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries – whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

This book originated as a collection of feature articles, previously published as magazine articles. They were chosen for publication in book form not only because they were so popular with readers in their original magazine appearances but also because they are so relevant in the field of introductory electronics — a subject area in which it is evermore difficult to find information of a technical, knowledgeable, yet understandable nature. This book is exactly that. Since its original publication, I have added significant new material to make sure it is all still highly relevant and up-to-date.

Content

Introduction

The theory of the emergence and spread of noise in the car

Methods for noise control in the vehicle

Review of materials used in sound insulation

Installation diagram noise insulation coating

Examples of sound insulation installation

Application

Content

Introduction

Upholstery tools and materials

Manual dismantling of interior parts

Mastering the art of sewing

Making upholstery pattern

Examples of ready patterns

Covers

Installation instructions autocovers

Leather interior with their own hands

Padding of the saloon ceiling

We produce door skin

Padding vinyl interior

Padding upholstery motorcycle seats

Renovation of the old sagging armchair

Eliminating failures heated seat

Nano Textile upholstery

Technology smart car flocking

The interiors of the converted cars

Книга посвящена применению программ Electronics Workbench фирмы Interactive Image Technologies (Канада) и VisSim корпорации Visual Solutuin Inc. (США) для моделирования элементов телекоммуникационных систем: модуляторов/демодуляторов, кодеков, каналов связи, цифровых фильтров, устройств синхронизации, отдельных функциональных узлов, устройств беспроводной связи (Wireless) IEEE 802.11, Bluetooth и др. Книга может быть использована в качестве учебного пособия при проведении лабораторных работ по указанным элементам и в этом качестве будет полезной для преподавателей и учащихся средних и высших учебных заведений, а также для инженеров-разработчиков и радиолюбителей. (Компакт-диск прилагается только к печатному изданию.)

В издании представлен ряд лабораторных работ по изучению электрических фильтров, выполняемых с помощью пакета Electronics Workbench, позволяющего проводить схемотехническое моделирование пассивных и активных фильтров различных типов. Предназначено для студентов 4-5 курсов, изучающих дисциплину «Микросхемотехника».