Скачать книгу - Packaging Terrorism

How to create packaging designs for consumer brands that effectively communicate in the retail environment Packaging Design: Successful Product Branding from Concept to Shelf is the most comprehensive resource of practical and professional information for creating packaging designs that serve as the marketing vehicles for consumer products. Packed with real-world advice, step-by-step descriptions of the creative process, and all-important insights into the stakeholders, the design process, and the production process, this book illuminates the business of packaging design like no other. Whether you're a designer, brand manager, or packaging manufacturer, the highly visual coverage in Packaging Design will be useful to you, as well as everyone else involved in the packaging design process. In one convenient book, you'll find: * Insightful images of the design process, design concepts, three-dimensional models, and prototypes * A wealth of case studies showcasing how superior packaging designs were created * A framework for today's packaging design business * Environmental considerations, along with legal and regulatory issues * Useful appendices with advice on portfolio development and professional practice guidelines

How to take the lead with sustainable packaging design solutions With initiatives like the Wal-Mart Scorecard in the U.S. and the E.U.'s Packaging Directive, delivering sustainable packaging is now an integral part of today's global competitive market. Written by experts from a wide variety of fields, here is a comprehensive, single source of actionable information that enables everyone involved in the design and development process to make smart, informed decisions, opening new possibilities for creating truly innovative solutions. Wendy Jedlicka, CPP (Roseville, MN) is President of Jedlicka Design Ltd. and a member of the faculty at Minneapolis College of Art and Design's groundbreaking Sustainable Design Certificate Program. A Certified Packaging Professional, she serves as Upper Midwest Chapter Chair (o2umw.org), as well as U.S. co-coordinator for the o2 Global Green Design Network (o2.org), and contributes frequently to Packaging Design magazine's «Sustainability Update» feature column.

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

This is the first comprehensive study of the core philosophical questions posed by terrorism such as: How should we define it? Is it morally distinctive? Can it be morally justified? Igor Primoratz seeks to overcome relativism and double standards that often plague debates about terrorism. He investigates the main ethical approaches to terrorism: in terms of its consequences, rights and justice, “supreme emergency,” and the collective responsibility of citizens. The book provides a rigorous, yet accessible analysis of a range of moral positions, from the acceptance of terrorism when its consequences are good on balance to its absolute rejection. Primoratz argues that terrorism is almost absolutely wrong. It may be morally justified only when an entire people is facing a true moral disaster, and this should be understood in a highly restrictive way. Conceptual analysis and normative arguments about the practice of terrorism are complemented with case studies of terror-bombing of German cities in World War II and the role of terrorism in the Israeli-Palestinian conflict. Terrorism: A Philosophical Investigation will be essential reading for researchers and students of philosophy and politics, and the general reader seeking to understand and evaluate acts and campaigns of terrorism.